Each new stage of lithography requires considerable material, temporal and technical resources. The so-called "Moore's Law" slowed down its operation, and even Intel, which considers it a matter of honor to maintain its viability, now doubles the density of transistor placement every two and a half years or even less. Intel itself "burnt" to the development of 10nm process technology and, although it has drawn all the necessary organizational conclusions, will be able to present its 7nm products only a few years later, as the head of Robert Swan recently admitted.
GlobalFoundries, which grew on the "sourdough" of AMD's former production units, as oil investors fed by UAE investors recently "had to go the distance" and refused to dominate 7nm technology , Fortunately, the former parent AMD did not suffer as it chose TSMC as the supplier of its advanced 7nm products at that time.
According to the EETimes website, the leaders of many large companies are aware of the challenges of lithography. The head of British ARM, Simon Segars, for example, is convinced that the cost of mastering the 5nm technology will be astronomical, and only those companies can afford the willingness to make those investments through a wide range of products justified in large quantities. Nobody can get optical scaling in the field of lithography in vain, he added.
Micron's chapter Sanjay Mehrotra further claims that the memory manufacturer segment suffers less from lithographic constraints. He is convinced that devices for traditional immersion lithography can produce solid-state memory chips with more than 200 layers, and that they can be used in the production of RAM in the six closest types of lithography processes. Micron's ultraviolet ultraviolet lithography (EUV) is only assembled if it is economically viable in mass production.
Representatives of Xilinx are also realistically considering the current state of lithography. Previously, with each new technical process, both increasing the speed of the transistors and reducing their power consumption and density could help you to use two of these benefits at the same time and be more likely to settle for one thing. The Xilinx leadership considers the separation of technical processes at 7 nm, 5 nm and 3 nm as a marketing convention. In this sense, it is much more important to solve specific technical problems encountered in mastering new lithography levels. Tight integration with CPUs. In a few years, a processor will be able to combine not only the cores with the main memory, but also the solid-state drives. The ARM chapter adds that engineers need some time to adapt their thinking to the peculiarities of new architectures consisting of heterogeneous components. However, the mutual influence of related industries makes it possible to maintain the pace of innovation at the semiconductor level.
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